K&T ltd

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Phone
86-0755-1...
Country
ChinaChina
Address
fu yong

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Company Description

With being in the industry for more than 10 years,wea are a professional PCB manufacturer.500 people and more than 30 engineers are dedicated to provide customer product with good quality.



A mature system provide the solution to the Prototype product, samples could be ready within 24 hours, and we can produce up to 30 layers.



With 5 Laser drillers, We can produce Mobile PCB,and Bluetooth related PCB.







please do not hesitate to drop your enuiry to us and look forward to hear from you soon.



Printed Circuit Board



Item Mass processing capability

Small batch processing capability



Layer (Max.)

2-28 26-32

Type of the board material FR-4, high TG board, aluminum board Rogers, etc., F4, BT



Rogers,etc

PTFE,PPO ,PPE

E-65,ect



Compound pressed board 4 layers 6 layers 6 layers 8 layers

Maximum Size 610mm X 1100mm

Outline Size Tolerance

±0.13mm ±0.10mm

V-CUT Deepness Tolerance

+/- 0.15 mm (V-CUT) ï¼?/- 0.1 mm (CNC V-CUT)

BoardThicknessRange

0.1mm--6.00mm 0.10mm--8.00mm

Board Thickness Tolerance( t�.8mm)

±8% ±5%

Board Thickness Tolerance (t�.8mm) ±10% ±8%

Medium Thickness

0.076mm--6.00mm 0.076mm--0.100mm

Minimum Line Width

0.75mmï¼?milï¼?0.063mm(2.5mil)

Minimum Line Distance

0.75mmï¼?milï¼?0.063mm(2.5mil)

Line Margin 0.2 mm (CNC��.30 mm (啤板)�0.50 mm (V-CUT)

Outer layer copper thickness 8.75um--175um 8.75um--280um

Inner layer copper thickness

8.75um--175um 8.75um--280um

Drill hole size (power drill)

0.25mm--6.00mm 0.15mm--0.25mm

Hole size (power drill)

0.20mm--6.00mm 0.10mm--0.15mm

Hole size tolerance (power drill) +/- 0.08 mm (copper immersion hole) +/- 0.05 mm (non- copper immersion hole) +0.1/-0.05 mm (injection hole)



Hole position deviation (power drill) +/-0.075mm: (drill hole) : +/- 0.10 mm (injection hole) 0.050mm

Laser hole size

0.10mm 0.075mm

Aspect Ratio

10:1 12:1

Solder mask type sensitive green, yellow, black, purple, blue ink

Minimum width of solder mask bridge 0.10mm 0.075mm

Minimum size of solder mask separation ring 0.05mm 0.025mm

Taphole diameter

0.25mm--0.60mm 0.60mm-0.80mm

Impedance tolerance

±10% ±5%

Surface processing type

HAL, plating nickel, thick & hard/soft metal, chemical nickel, lead-free tin immersion, lead-free H.A.S











pcb

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