Danyang Soltec Co., Ltd.

We are well established as a solution for Hi-Tech Fine Line Solder Paste Soldering, our unique production methods ensure precise control of Solder Spheres and Flux purity.

One of our core competences is our ability to
control Solder Sphere size in the range of 5 to 10 microns.

We offer 63/37 & Lead Free solder pastes and Solder Wire
to meet all European and Asian standards.

Samples of Solder Paste and Flux are available on request.

In addi
tion SPS is able to provide very high quality solutions for Hi-Tech Flexible Printed Circuits (FPS)

Offering High Dens
ity 50/50 microns & 30/30 micron Conductor spacing, for applications such as Mobile, PDP, LCD etc.

Liquid Photo Resis
t (LPR), Negative type RPC, Photo Resist Solutions for LCD. FCOF - Flip Chip Bonding.

The SPS product range includes F
PC Single Sided, Double Sided, Multilayer, Rigid Flexible,
SMT, FCOF. & Flexible SMT Assembly.

We have support sta
ff based in Shenzhen China, Hong Kong, Shihung Korea,and London UK able to provide a full support service.